• Model:ABM/6/500/DUV/DCCD/M

    Status: Operating

    Function:1.Substrate: 6-inch and smaller silicon wafers, glass, etc.;
    2.Lithography of micro-nano structures and device patterns with a minimum line width of 1 μm;
    3.Single-sided alignment lithography.

    West Area,Lithography Zone I+86-21-34206126-6029
  • Model:Auriga

    Status: Operating

    Function:Fabrication of two-dimensional and three-dimensional structures through patterning deposition, cutting, and etching of samples at the micro-nano scale

    West Area,Thin Film Zone IA+86-21-34207734-8006
  • Model:DWL66+

    Status: Operating

    Function:600nm~Micron-level process capability photoresist direct writing function, overlay direct writing function and 3D grayscale lithography function

    East Area,Lithography Zone ⅢA+86-21-34206126-6005
  • Model:uMLA

    Status: Operating

    Function:Photoresist direct writing function, which directly writes micron-scale photoresist patterns on the substrate; overlay direct writing function; SU8 photoresist direct writing function

    East Area,Lithography Zone ⅢA+86-21-34206126-6005
  • Model:MPO100

    Status: Operating

    Function:Structuring photoresist using two-photon polymerization (TPP) technology enables 3D lithography and 3D micro-printing of microstructures, with applications in optics, photonics, mechanics and biomedical engineering.

    East Area,Lithography Zone ⅢA+86-21-34206126-6030
  • Model:Vitrion M 5000 Gen2

    Status: Operating

    Function:1.Fabricate glass through-holes
    2.Fabricate glass cavities (through cavities and blind cavities)

    East Area,Compound Semiconductor Zone+86-21-34206126-6031
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