Function：1.Double-sided photolithography patterning for wafers and fragments of 6 inches and below.
2.Minimum pattern resolution down to 0.8μm.
3.Provides high-precision alignment for bonded wafers and chips in conjunction with wafer bonding systems.
4.Can be matched with the EVG-510 bonder to realize wafer alignment and positioning functions.

Function：1.Substrate: 6-inch and smaller silicon wafers, glass, etc.;
2.Lithography of micro-nano structures and device patterns with a minimum line width of 1 μm;
3.Single-sided alignment lithography.

Function：Fabrication of two-dimensional and three-dimensional structures through patterning deposition, cutting, and etching of samples at the micro-nano scale

Function：600nm~Micron-level process capability photoresist direct writing function, overlay direct writing function and 3D grayscale lithography function

Function：Photoresist direct writing function, which directly writes micron-scale photoresist patterns on the substrate; overlay direct writing function; SU8 photoresist direct writing function

Function：Structuring photoresist using two-photon polymerization (TPP) technology enables 3D lithography and 3D micro-printing of microstructures, with applications in optics, photonics, mechanics and biomedical engineering.