Function：High-precision flip-chip interconnection and coupling process for optoelectronic chips, laser chips and other related chips. It supports cold pressure welding, reflow soldering, in-situ reflow, flux-free eutectic bonding, thermocompression bonding and other processes for various types of chips.

Function：Supports cold pressing, thermocompression reflow and eutectic processes for various types of chips. The equipment is capable of flip-chip bonding and face-up bonding, enabling bonding modes such as chip-to-chip and chip-to-wafer.

Function：1. Achieve tight bonding of two or more wafers to realize high-density interconnection among multiple wafers, which is widely applied especially in 3D IC packaging. 2. Support a variety of wafer bonding processes, including anodic bonding, eutectic bonding, thermocompression bonding and others. 3. Compatible with the EVG-610 lithography machine to realize wafer alignment and positioning functions. 4. Be compatible with pre-processes such as plasma cleaning and wet cleaning for wafer surface treatment in the early stage.

Function：The equipment supports wire bonding processes including ball bonding, wedge bonding, and ball placement.

Function：The equipment is used for selective laser ball placement and array micro-bump fabrication on the pads of chips, various substrates, wafers and other devices.

Function：Wafer thinning processing is available for chip fabrication.