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Packaging Processes
  • DAD3650 Dicing SawReservation

    Model：DAD3650

    Status： Operating

    Function： It adopts blade physical dicing.Applicable materials: silicon wafer, SOI, glass, quartz, sapphire, silicon carbide, ceramic and other semiconductor materials.

    West Area Packaging Zone I+86-21-34207734-8016
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SERVICE AND INNOVATION FOR MICRO/NANOTECHNOLOGY

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Tel: +86 21 3420 7734

Email: aemd@sjtu.edu.cn

  • AEMD-SJTU
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