Our fabrication facilities cover core micro- and nano-processing technologies, including photolithography (electron beam, KrF deep ultraviolet, and double-sided lithography), thin-film deposition (magnetron sputtering, electron-beam evaporation, and LPCVD), and etching (deep silicon, ion beam, and wet etching). The platform is also equipped with wafer bonding, wire bonding (WB), and copper–nickel electroplating, as well as ion implantation, oxidation and diffusion, and CMP polishing, enabling a complete process flow from nanoscale patterning to wafer-level packaging for the fabrication of micro- and nano-devices based on silicon, glass, III–V compounds, and organic materials.

The packaging processes cover wafer bonding (including anodic, eutectic, and thermocompression bonding), high-force die bonding (supporting solder ball diameters of 40–450 μm), dicing and semiconductor material thinning (ceramics, silicon wafers, and metals), micro-assembly and flip-chip bonding, as well as gold and aluminum wire bonding. The platform is also compatible with advanced processes such as 3D IC packaging and optoelectronic chip coupling.

Characterization and testing equipment enables in-line and off-line process monitoring and characterization, as well as optical and electrical performance evaluation. The facilities include surface morphology measurement tools (AFM, SEM, laser confocal microscopy, etc.), thin-film thickness measurement systems (ellipsometer, UV interferometric film thickness measurement system, profilometer, etc.), thin-film property characterization instruments (UV–Vis spectrophotometer, thin-film stress measurement system, high-resolution X-ray diffractometer, four-point probe film resistance measurement system, electrochemical CV doping concentration measurement system, surface defect analysis system, etc.), and electrical and optical performance testing systems for devices and chips (semiconductor parameter analyzer, Hall effect measurement system, optoelectronic testing system, etc.).