Electroplating / Electroforming - Micro-/Nano Fabrication - Facilities - 上海交通大学先进电子材料与器件平台

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Micro-/Nano Fabrication

Electroplating / Electroforming

Copper electroplating tank Reservation

Model：

Status： Maintenance

Function：Copper Electroplating

East Electroplating Area+86-21- 34206126-6031
Copper Electroplating Reservation

Model：µGALV

Status： Operating

Function：Copper Electroplating

East Electroplating Area+86-21- 34206126-6031
Electroplating System TSV Cu Reservation

Model：µGALV

Status： Operating

Function：电镀填充硅盲孔、硅通孔、玻璃盲孔、玻璃通孔等高深宽比结构。

东区电镀区+86-21- 34206126-6031
Gold Electroplating Reservation

Model：µGALV

Status： Operating

Function：Gold Electroplating

East Electroplating Area+86-21- 34206126-6031
Nickel Electroplating Reservation

Model：µGALV

Status： Operating

Function：Nickel Electroplating

East Electroplating Area+86-21- 34206126-6031
Nickel‑Iron Electroplating Reservation

Model：µGALV

Status： Operating

Function：Nickel‑Iron Electroplating

East Electroplating Area+86-21- 34206126-6031

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SERVICE AND INNOVATION FOR MICRO/NANOTECHNOLOGY

Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China

Tel: +86 21 3420 7734

Email: aemd@sjtu.edu.cn

AEMD-SJTU

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