This equipment is mainly used for gold electroplating with environmentally friendly cyanide-free plating solution. The electroplated gold layer exhibits excellent electrical conductivity, corrosion resistance, solderability and thermocompression bonding performance, making it an ideal material for I/O contacts and chip interconnection of integrated circuits. Gold electroplating can be applied to various processes of IC chip packaging, including lead frame gold plating, chip pin gold plating, solder ball connection and other applications.

Process / Testing Capabilities

• Line width: 10 μm and above;
• Plating thickness: 0.5–10 μm;
• Standard wafers: 3-inch, 4-inch and 6-inch;
• Wafer thickness: 350 μm–1000 μm. Broken wafers are acceptable, with sample size less than 150 mm.

Technical Specifications

• Standard wafers in 3-inch, 4-inch and 6-inch sizes;
• Adjustable deposition rate;
• Support pulsed voltage mode;
• Current range: 0–1 A, minimum 2 mA, accuracy 1 mA.