Electroplating System Ni

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Nickel Electroplating

Operating

Model：	µGALV
Function：	Nickel Electroplating
Engineer：	Ms.Tian / +86-21- 34206126-6031 / miaotian@1
Location：	East Electroplating Area
Equipment ID：	EPL0NIK01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

This equipment is mainly used for nickel electroplating. Electroplated nickel features good electrical conductivity, stability and ductility, and is widely applied in semiconductor interconnection processes, chip protection, corrosion prevention and other fields.

Process / Testing Capabilities

Line width: 10 μm and above;
Plating thickness: 0.5–20 μm;
Compatible with 3-inch, 4-inch and 6-inch standard wafers;
Wafer thickness: 350 μm–1000 μm;
Special-shaped samples (including broken wafers) within 150 mm are acceptable.

Technical Specifications

Standard wafers in 3-inch, 4-inch and 6-inch sizes;
Adjustable deposition rate;
Pulsed voltage available;
Current: 0 – 10 A, minimum 5 mA, accuracy of 1 mA.

Nickel electroplating is an electrochemical process that deposits a nickel layer on the substrate surface. The plating solution is composed of nickel salts, conductive salts, pH regulators and other additives. During the electroplating process, the substrate serves as the cathode. Upon electrification, nickel ions are reduced and deposited on the cathode surface to form a nickel coating.

Nickel Electroplating Process:(1) Photoresist thickness: 5 μm for pattern formation;(2) Electroplate nickel with a thickness of 0.5–1.5 μm.

Sample size shall be less than 6 inches. Cu, Au and other materials are acceptable as seed layers, while Ni and stainless steel seed layers are not recommended. Special-shaped samples will increase processing time. Please communicate with the process engineer in advance.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

需要什么种子层

Cu，Ni

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