This equipment is mainly used for nickel-iron electroplating. The nickel-iron electroplated layer is an excellent magnetic coating. Its corrosion resistance is comparable to that of nickel plating, while it features higher hardness and better toughness than pure nickel coating. It can also replace bright nickel plating in certain electronic industry applications and is widely used in semiconductor interconnection processes.

Process / Testing Capabilities

• Line width: 10 μm and above;
• Plating thickness: 1–20 μm;
• Compatible with 3-inch, 4-inch and 6-inch standard wafers;
• Wafer thickness: 350 μm–1000 μm;
• Special-shaped samples (including broken wafers) below 150 mm are acceptable.

Technical Specifications

• Standard wafer sizes: 3-inch, 4-inch and 6-inch;
• Adjustable deposition rate;
• Pulsed voltage plating available;
• Current range: 0–10 A, minimum output 5 mA, accuracy 1 mA.