Copper Plating Sink

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Copper electroplating tank

Copper Plating Sink

Maintenance

Model：
Function：	Copper Electroplating
Engineer：	Ms.Tian / +86-21- 34206126-6031 / miaotian@1
Location：	East Electroplating Area
Equipment ID：	EEPOCUP01

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Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

In micro-nano fabrication, copper electroplating is primarily used to fabricate high-precision interconnects, MEMS devices and conductive structures for advanced packaging. Owing to its excellent electrical conductivity, superior filling capability and high fidelity for micro/nano-scale patterns, it has become one of the key processes for integrated circuits and microsystems.

Process / Testing Capabilities

Only metallic copper (Cu) can be deposited.The line width shall be greater than 20 μm, the sample size smaller than 4 inches, and the thickness more than 1 μm.

Technical Specifications

Sample size: less than 4 inches;Voltage range: 0–5 V;Coating uniformity: ±10%;Poor throwing power;No deep plating capability.

Copper electroplating is a process that deposits metallic copper on the surface of conductive substrates based on the electrolysis principle. The substrate (cathode) and copper anode are immersed in copper ion-containing electrolyte (such as copper sulfate plating solution). After power-on, the copper at the anode undergoes oxidative dissolution（Cu→Cu²⁺+2e⁻）. Copper ions gain electrons at the cathode and are reduced to metallic copper（Cu²⁺+2e⁻→Cu）, forming a dense coating. Parameters including current density, temperature and additives can be controlled to adjust the coating thickness, uniformity and surface morphology.

Copper electroplating is applied to interconnects of integrated circuits to realize high-precision conductive connections.

Edge removal, with copper seed layer.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

最厚可以做多厚

没有限制

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