The high-precision optoelectronic chip coupling system is specially designed for high-precision low-pressure bonding and reflow soldering processes, and is applied to high-precision flip-chip interconnection and coupling of optoelectronic chips, laser chips and other similar chips.

Process / Testing Capabilities

• The equipment supports cold pressure welding, reflow soldering, in-situ reflow, flux-free eutectic bonding, thermocompression bonding and other processes for various types of chips.
• It is equipped with flip-chip bonding and face-up bonding functions, enabling chip-to-chip and chip-to-wafer bonding modes.
• Bonding media including gold, gold-tin, tin, tin-silver, indium and copper are supported; independent temperature control of the upper and lower chips can be realized in pressure welding processes.

Technical Specifications

• Interconnection accuracy: ±0.5 μm;
• Bonding pressure: 0.2～10N;
• Temperature control range: Room temperature to 400 ℃ (bond arm); Room temperature to 400 ℃ (stage); resolution: 1 ℃;
• Chip size: 0.25×0.25 mm – 22×22 mm (bond arm), 2×2 mm – 50×50 mm (stage)