The high-force chip bonder features precise parallelism adjustment capability for chips, high bonding pressure and superior bonding accuracy, enabling its extensive applications in the assembly of optoelectronic and photonic devices, focal plane devices, 3D integration and other related fields.

Process / Testing Capabilities

• The high-force chip bonder supports cold pressing, thermocompression reflow and eutectic processes for various chips;
• The equipment is equipped with flip-chip and face-up bonding functions, and can realize bonding modes such as chip-to-chip and chip-to-wafer.

Technical Specifications

• Interconnection accuracy: ±1–3 μm;
• Bonding pressure: 0.6～2000N, resolution: 0.06N–2N;
• Temperature control range: Room temperature to 450 ℃ (bond arm); Room temperature to 350 ℃ (stage); resolution: 1 ℃;
• Chip size: 2×2 mm – 50×50 mm (bond arm), 2×2 mm – φ200 mm (stage)