It is used for thinning 8-inch and smaller wafers (including SOI, silicon, glass, copper sheets and other semiconductor materials), with a thickness accuracy within 2 μm. The equipment facilitates the subsequent packaging process.

Process / Testing Capabilities

It is applicable to the thinning of 8-inch and smaller wafers, including SOI, silicon, glass, copper sheets and other semiconductor materials. The thickness accuracy can be controlled within 2 μm, and the equipment provides convenience for subsequent packaging processes.

Technical Specifications

• Grinding wheel speed: 1000–7000 rpm
• Worktable rotational speed: 0–300 rpm
• Output power: 2 kW
• Y-axis machining stroke: less than 430 mm; Y-axis feeding speed: 0.01–50 mm/s; Y-axis minimum displacement: 1 μm