Laser ball placement machines are used for selective laser ball planting and array micro-bump machining on the pads of semiconductor and microelectronic devices such as single chips, various substrates, wafers and BGAs. They are especially suitable for the fabrication of flip-chip bumps on single chips and ball placement for fine-pitch solder balls.

Process / Testing Capabilities

The laser ball placement machine supports solder ball diameters ranging from 40μm to 450μm, is compatible with various common alloy solder balls, and enables non-contact bonding.

Technical Specifications

• Worktable size: 320×320mm;
• Solder ball diameter range: 40μm–450μm;
• Compatible with solder balls of various alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi, etc;
• Maximum bumping speed: 5 balls per second.