F&S BONDTEC

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F&S Wire Bonder

F&S BONDTEC

Operating

Model：	53XXBDA
Function：	The equipment supports wire bonding processes including ball bonding, wedge bonding, and ball placement.
Engineer：	Ms.Liu / +86-21-34207734-8016 / liuxinyuan@1
Location：	West Area Packaging Zone I
Equipment ID：	WT1FWIB01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

The equipment provides two wire bonding processes: gold ball bonding and deep wedge bonding.The 53xx BDA is equipped with a built-in motorized Y-axis. It can programmably generate complete wire loops, and wire tail cutting is also fully programmable.In addition, the machine supports bumping function and continuous wire bonding. All process parameters are programmable and stored on the internal hard disk, which can be quickly displayed and recalled intuitively via the color LCD screen.

Process / Testing Capabilities

Chip size: below 4 inches;
Wire diameter: Gold wire 17.5μm～75μm;
Thermal chuck temperature: Room temperature～200℃ (adjustable);
Wire feeder: 1/2″ spool, 2″ spool.

Technical Specifications

Manual XY travel range of bonding head: 18mm×18mm, stepping accuracy 2μm;
Manual Z stroke of bonding head: 60mm, stepping accuracy 1μm;
Ultrasonic power: 0～5W;
Programmable bonding force: 5～150cN

Wire bonding is a process that uses fine metal wires to achieve firm welding between metal leads and substrate pads by applying thermal energy, pressure and ultrasonic energy, so as to realize electrical interconnection between chips and substrates as well as information communication among chips.

Under ideal controlled conditions, electron sharing or atomic interdiffusion occurs between the lead and the substrate, enabling atomic-level bonding between the two metals.

The 53XXBDA supports packaging processes such as ball bonding, wedge bonding and bumping.

The sample size shall be less than 4 inches, and the sample surface must be kept clean to prevent oxidation.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

铜pad能不能打

可以，不过要保持干净且未氧化

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