As a maskless lithography technology, laser direct writing lithography uses a laser beam with variable intensity to perform variable-dose exposure on the photoresist material on the surface of a substrate. After development, the required patterns are formed on the surface of the photoresist layer. It enables high-precision processing without the need for fabricating masks, and is applicable to the processing of various materials, including glass, metals, silicon wafers, semiconductors, polymers, and others.

It can be applied to the processing of a variety of different materials, including glass, metal, silicon wafers, semiconductors, polymers, etc. It is widely used in fields such as microelectronics, biomedicine, optics and nanodevices, and can be used to fabricate microprocessors, sensors, microstructures, biochips, microfluidic chips, MEMS and other microelectronic devices.