This equipment is primarily used for laser-induced modification of glass substrates. After modification, wet etching enables the fabrication of through-glass vias (TGVs), glass cavities, and blind cavities.The resulting structures feature clean edges with no debris or micro-cracks and high geometric accuracy, making them suitable for bonding processes and TGV-based applications.

• Via diameter ≥ 10 μm
• Through-hole depth up to 500 μm
• Typical aspect ratio: 10:1 (depth:diameter), up to 50:1 max
• Taper angle: 0.7°–8°

• Maximum modification depth: 500 μm
• Supports all standard wafer sizes: 100 mm, 150 mm, 200 mm, 300 mm, and 450 mm
• Substrate size: ≤ 510 × 510 mm²
• Wafer thickness: ≤ 500 μm; fragmented wafers and non-standard (irregular) wafers are not supported