Function：Primarily used in the photolithography development process. Utilizes spray development technology to ensure uniform development, suitable for high-precision microelectronics and semiconductor manufacturing.

Function：Spray-type development for substrates up to 6 inches

Function：Forms a hydrophobic layer on the wafer surface using HMDS , removes moisture, and enhances the adhesion between photoresist and substrates (such as silicon and glass).

Function：1. Substrate vacuum dehydration； 2. Vacuum baking (up to 200°C).

Function：Primarily used in photolithography baking processes, including photoresist pre-baking, post-baking, and other thermal treatments. Ensures uniform heating to improve pattern quality and adhesion.

Function：Photoresist baking