Semi-Automatic Hotplate
Hotplate 200
Operating
Model: HP-200
Function: Primarily used in photolithography baking processes, including photoresist pre-baking, post-baking, and other thermal treatments. Ensures uniform heating to improve pattern quality and adhesion.
Engineer: Zhang / +86-21- 34206126-6029 / captianzhangdi@1
Location: East Area, Lithography IIIA Zone
Equipment ID: EDD2HPS01、EDD2HPS02
  • Basic Equipment Information
  • Operating Principle
  • Typical Application Case
Main Applications
  1. Used for wafer thermal processing in photolithography, including photoresist soft bake (post-coating bake) and post-exposure bake  
  2. Applicable to other temperature-controlled thermal processes such as material curing and stress relief  
  3. Supports wafers up to 8 inches and smaller sizes

 

Process / Testing Capabilities
  1. Supports various temperature settings for soft bake and post-bake process optimization  
  2. Adjustable proximity distance between wafer and hotplate to evaluate heat transfer efficiency and baking uniformity  
  3. Enables evaluation of thermal effects on pattern resolution, edge integrity, photoresist adhesion, and thermal stability  
  4. Suitable for process window development, validation, and parameter optimization  
  5. Supports multi-size wafer processing up to 8 inches for research and pilot-scale applications

 

Technical Specifications
  1. Temperature range: 0°C to 250°C 
  2. Temperature accuracy: ±0.6°C at 100°C 
  3. Operating mode: proximity heating; gap adjustable from 0–8 mm via pins 
  4. Wafer compatibility: up to 8 inches, compatible with smaller sizes 

Used in photolithography baking processes, including photoresist soft bake, post-exposure bake, and other thermal treatments. The system ensures uniform heating to improve pattern quality and adhesion.

1、Samples must be confirmed with process engineers in advance 
2、Both frontside and backside of the samples must be flat and clean 

Available for use throughout the day. Samples must be confirmed with process engineers in advance. Both frontside and backside of the samples must be flat and clean. Please keep the equipment clean and tidy after use

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.
FAQs
  • 01
    Is it necessary to remove the protective glass plate?

    No, it is not required.

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