Developer SMD-200

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Semi-Automatic Developer

Developer SMD-200

Operating

Model：	SMD-200
Function：	Primarily used in the photolithography development process. Utilizes spray development technology to ensure uniform development, suitable for high-precision microelectronics and semiconductor manufacturing.
Engineer：	Zhang / +86-21- 34206126-6029 / captianzhangdi@1
Location：	East Area , Photolithography Ⅲ A Zone
Equipment ID：	EDD2SMD01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Applications

Used for photoresist pattern development processes
Supports multiple development methods, including spray development, immersion development, and flow rinse
Widely applied in high-precision pattern transfer processes for IC manufacturing, MEMS fabrication, optoelectronics, and sensors

Process / Testing Capabilities

Supports development processes for wafers of 2–8 inches
Programmable with up to 20 development steps for complex process flows
Supports high-speed rotational development (0–3000 rpm)
Development head supports spray, immersion, and flow modes; robotic arm enables automatic reciprocating motion
Supports post-development nitrogen drying, spin drying, and backside rinse

Technical Specifications

Compatible with 2/3/4/5/6/7/8 inch wafers
Supports up to 20 programmable steps
Spin speed range: 0–3000 rpm; acceleration reaches 6000 rpm within 0.3 seconds
Supports multiple development modes: robotic arm movement, immersion, flow, and spray
Supports nitrogen drying, spin drying, and backside rinse

The Sawatec SMD-200 employs spray development technology, where the developer is precisely sprayed to uniformly cover the photoresist surface, dissolving and removing either exposed or unexposed regions depending on the process. Combined with rotational control and liquid flow regulation, the system ensures uniform development and enhances process precision in microelectronics and semiconductor manufacturing.

1、Samples must be confirmed with process engineers in advance
2、Both frontside and backside of the samples must be flat and clean

Available for use throughout the day. Samples must be confirmed with process engineers in advance. Both frontside and backside of the samples must be flat and clean. Please keep the equipment clean and tidy after use.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

How to place wafers of different sizes?

Remove the knob, adjust it according to the wafer size, and reinstall it accordingly

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