The HMDS oven (Hexamethyldisilazane oven) is primarily used in photolithography processes in semiconductor manufacturing and microelectronics. It is used for wafer surface pretreatment by heating wafers and exposing them to HMDS vapor, thereby enhancing the adhesion between photoresist and the wafer surface. This step is critical for ensuring the accuracy and stability of photolithographic patterns, ultimately improving device quality and performance. Additionally, the HMDS oven can be used in other processes requiring enhanced surface adhesion.

1. Supports a wide range of wafer sizes (up to 8 inches)  
2. Chamber can be filled with HMDS vapor for vapor-phase reaction processing  
3. Adjustable heating temperature and processing time for process optimization

1. Temperature range: 25°C to 200°C, adjustable with stable control  
2. Processing method: HMDS vapor-phase treatment with controlled gas circulation and exhaust  
3. Reaction mechanism: HMDS forms a hydrophobic monolayer on the substrate surface, improving adhesion between photoresist and substrates (e.g., silicon, glass)  
4. Wafer compatibility: Supports up to 8-inch wafers and smaller sizes