developer

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Single-Wafer Developer

developer

Operating

Model：	developer
Function：	Spray-type development for substrates up to 6 inches
Engineer：	Wang / +86-21- 34206126-6005 / fdwang@1
Location：	West Area, Lithography I Zone
Equipment ID：	WPHLEDC01

Reservation

Basic Equipment Information
Operating Principle

Main Applications

After exposure, wafers are processed in the developer using a developing solution to remove selected regions of photoresist.

Process / Testing Capabilities

Spray-type development for substrates up to 6 inches.

Technical Specifications

Rotation speed: 0–12,000 rpm
Motor speed stability: error < ±1%

Development is the process of placing exposed wafers into the developer and applying a developing solution to remove either exposed or unexposed photoresist, depending on the process type.

Supports standard wafers from 2” to 6”. Supports fragments larger than 10 mm × 10 mm

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Wafer cannot be properly held by vacuum during operation

Clean the chuck surface and the backside of the wafer promptly

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