| Model： | High accuracy hotplate |
|---|---|
| Function： | Photoresist baking |
| Engineer： | Wang / +86-21- 34206126-6005 / fdwang@1 |
| Location： | West Area, Lithography I Zone |
| Equipment ID： | WPHSHTP01 |
Photoresist Baking for the Maximum 8-inch Substrate in Semiconductor Lithography Process
Supports thermal processing for substrates of 8 inches and below
Standard semiconductor silicon wafers or glass wafers, sample size ≤ 8"
Inspect the equipment status prior to use and exercise caution when placing samples to avoid scalding by the hot plate that has not cooled down completely from the previous use. The photoresist on the edges and back of the sample must be thoroughly removed before placing the sample on the hot plate for thermal processing, to prevent contamination of the hot plate by residual photoresist. Scraping or scratching the coating on the hot plate surface with hard materials such as metal is strictly prohibited. Turn off the hot plate in a timely manner after use.
Restart the equipment
Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China
Tel: +86 21 3420 7734
Email: aemd@sjtu.edu.cn
