vacuum oven

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Vacuum Oven

vacuum oven

Operating

Model：	VD53
Function：	1. Substrate vacuum dehydration； 2. Vacuum baking (up to 200°C).
Engineer：	Xu / +86-21- 34206126-6018 / xu.jian@1
Location：	West Area, Lithography I Zone
Equipment ID：	WPHBOVV01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Applications

Wafers are dehydrated and baked in a vacuum environment to remove excess moisture from the wafer surface.

Process / Testing Capabilities

Temperature range: ambient +15°C to 200°C
Chamber volume: 53 L
Temperature deviation: ±2°C at 100°C
Heating time to 100°C: 80 min
Ultimate vacuum: 0.01 mbar

Technical Specifications

Temperature range: ambient +15°C to 200°C
APT.line™ preheating chamber technology
Controller with interval programming and real-time programming capabilities
Equipped with two aluminum expansion racks

In a vacuum environment, the wafer is heated through chamber heating and thermal conduction, causing moisture on the wafer surface to evaporate.

Semiconductor standard silicon wafers or glass substrates

1.Ensure familiarity with the standard operating procedure before use
2.Confirm that the vacuum pump is operating, pipelines are normal, main power is on, and the chamber door is properly locked during operation
3.After use, ensure the temperature has returned to room temperature and the chamber has been vented to atmospheric pressure
4.Close the chamber door after operation

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Can 8-inch wafers be processed?

Yes.

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