Function：Non-contact thin film thickness measurement. A selectable wavelength range from ultraviolet to near-infrared. An automated stage with pattern recognition enables precise measurement at designated micro-scale locations.

Function：It is primarily used for structural observation and measurement of micro- and nano-fabricated samples.

Function：It is used to characterize the epitaxial structure, film thickness, crystallinity, crystal orientation, and interfacial relaxation of single-crystal thin films on 4-inch semiconductor wafers.

Function：It is used for inspection and analysis of wafer surface defects. It rapidly classifies defects (including particles, scratches, pits, watermarks, and residue marks), counts the number of each defect type, and measures the corresponding defect sizes. Finally, it generates a defect distribution map of the entire surface and a detailed inspection report. Based on predefined defect criteria, the system can also determine whether the inspected sample passes or fails.

Function：High-resolution microscopic morphology observation and micro-area compositional analysis.

Function：High-resolution microscopic morphology observation and micro-area compositional analysis.