Function：1.Evaporative deposition of various conventional metal thin films; 2.Evaporative deposition of magnetic thin films including nickel; 3.Oblique evaporation at ±45° is achievable.

Function：Capable of depositing high-quality thin films with precisely controllable thickness at room temperature, including elemental metals (especially refractory precious metals such as Pt and Pd) and various compound materials.

Function：It enables the deposition of high-quality gold films, silver films, and low-melting-point compound films such as MgF2, WO3 and ZnS at room temperature.

Function：Sample size: up to 6 inches; low-temperature deposition of silicon dioxide and silicon nitride thin films.

Function：Low-temperature (300 ℃) deposition of thin films such as silicon oxide, silicon nitride, amorphous silicon, silicon oxynitride and silicon carbide.

Function：It is used for low-temperature (130 ℃) deposition of thin films such as SiO₂ and SiNₓ, as well as TEOS-based films. It can also deposit doped film materials including PSG, BSG and BPSG.