| Model: | E550D |
|---|---|
| Function: | Capable of depositing high-quality thin films with precisely controllable thickness at room temperature, including elemental metals (especially refractory precious metals such as Pt and Pd) and various compound materials. |
| Engineer: | Fu / +86-21- 34206126-6010 / xuecheng.f@1 |
| Location: | Thin Film Zone IV, East Area |
| Equipment ID: | EFM3EBE01 |
At room temperature, metal thin films such as Cr, Cu, Ni, Al, Y, Ti, Pt and Pd can be deposited by evaporation on samples smaller than 8 inches, fully meeting the requirements of the lift-off process.
Process/Testing Capability
Technical Specifications

Thermal electrons emitted by the tungsten filament are accelerated and focused by the high-voltage electric field between the cathode and anode, then deflected by a magnetic field to reach the surface of the evaporant material in the crucible. The electron bombardment induces lattice vibration and heat release, melting or subliming the material to complete evaporative deposition.

Thin-film transistor devices fabricated with electron-beam evaporated palladium (Pd) thin films
双腔电子束蒸发镀膜系统具有6个坩埚位,可以蒸镀多层薄膜。
双腔电子束蒸发镀膜系统电子枪功率更大,可以蒸镀难熔的Pt、Pd等贵金属薄膜。
衬底尺寸更大,可以满足8英寸样品的制备,也可以同时蒸镀3个4英寸的样品。