Electron Beam Evaporation

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Denton Electron Beam Evaporator

Operating

Model：	Explorer-14
Function：	1.Evaporative deposition of various conventional metal thin films; 2.Evaporative deposition of magnetic thin films including nickel; 3.Oblique evaporation at ±45° is achievable.
Engineer：	Fu / +86-21- 34206126-6010 / xuecheng.f@1
Location：	Thin Film Zone IA, West Area
Equipment ID：	WF1DEGN01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

Mainly used for evaporating metal thin films such as gold, silver, aluminum, copper, chromium, titanium and nickel. It is applicable to electrode fabrication via the lift-off process and can meet the demand for thin film deposition by oblique evaporation within a 45° angle.

Process/Testing Capability

The equipment is equipped with an in-situ function for monitoring deposition thickness, supporting film deposition in the range of 1 nm to 5 μm. It can deposit a variety of metal thin films such as gold, silver, aluminum, copper, chromium, titanium and nickel. The worktable temperature is adjustable between 25 ℃ and 200 ℃.

Technical Specifications

The uniformity of 6-inch thin films is within ±3%, and the repeatability fluctuation error of fabricated film thickness is within ±2%. The deposition rates for evaporated gold, silver, copper, aluminum, titanium, chromium and nickel are all higher than 2 Å/s.

Thermal electrons emitted by the filament are accelerated and focused by the high‑voltage electric field between the cathode and anode, then deflected by a magnetic field to strike the surface of the evaporant in the crucible. The bombardment excites lattice vibration and generates heat, which melts or sublimes the material to achieve evaporative deposition.

Interdigital electrodes for surface acoustic wave (SAW) devices. On the substrate after photolithography and development, a 1 μm-thick copper film is evaporated to serve as lead electrodes, and the targeted patterns are formed after the lift-off process.

1.Thick platinum films (above 100 nm) and samples larger than 6 inches are not accepted.

2.Coating is prohibited on sub-millimeter micro-particle samples.

3.Deposition of high-melting-point and highly contaminative metals including molybdenum and tungsten is not allowed.

4.Evaporated oxide films are unsupported.

5.Thick films of magnetic materials (Fe, Ni) exceeding 200 nm are not acceptable.

1.Warning: High voltage hazard during operation.

2.Cut off all power before opening the chamber.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

电子束蒸镀薄膜剥离困难是什么情况？

可能是金属覆盖较好，有机溶剂无法浸入溶解光刻胶，可以尝试边缘贴胶带，留出空间
02

电子束蒸镀工件台的温度一般多高？

一般不会超过60摄氏度
03

电子束蒸镀时出现飞溅怎么办？

将程序中的功率改小，降低束流
04

电子束蒸镀设备可以蒸镀介质薄膜吗？

原则上不可以，因为电子转移困难

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