Function：1. This equipment can perform surface modification and functionalization on high-aspect-ratio structures of semiconductor-compatible and biocompatible substrates such as silicon wafers and glass slides in a vapor-phase environment. It can form highly uniform monolayer thin films to achieve hydrophobic surfaces, hydrophilic surfaces, and functional surfaces with specific functional groups, supporting relevant semiconductor and biochemical experiments. 2. This device can be used in conjunction with the nanoimprint lithography system purchased in the second phase of the AEMD platform. It effectively improves the surface release quality of nanoimprinting and further enhances the pattern fabrication capability of the nanoimprint equipment. 3. As a fully functional surface modification system, this instrument supports multiple deposition modes, including ALD (Atomic Layer Deposition), CVD (Chemical Vapor Deposition) and SAM (Self-Assembled Monolayer) deposition.

Function：It is equipped with two operating modes, thermal ALD and PE-ALD. Thin film deposition can be realized by heating or plasma assistance to prepare a variety of ultra-thin dielectric films with high conformality and excellent step coverage, such as metal oxides. The film thickness can be precisely controlled at the atomic layer level (1 atom-layer per cycle). Depositable films include aluminum oxide Al2O3, aluminum nitride AlN, silicon dioxide SiO2, hafnium oxide HfO2, hafnium nitride Hf3N4, titanium dioxide TiO2, tantalum pentoxide Ta2O5 and tantalum nitride TaNx.

Function：Used for depositing ultra-thin, highly uniform, and highly conformal metal thin films (e.g., Cu, TiN, Ru), suitable for high-aspect-ratio structures such as TSVs and deep trench devices.

Function：Hot-wall tube CVD system for nanomaterial growth, suitable for research and production of carbon nanotubes (CNTs) and graphene thin films.

Function：Deposition of Parylene C, D, N, and F materials.