This system is used for the deposition of poly-para-xylylene (Parylene) thin films, including types C, D, N, and F. The achievable film thickness ranges from 500 nm to 50 μm.

Process / Testing Capabilities

• Maximum substrate size: up to 6 inches
• Thickness non-uniformity: approximately ±5%
• Deposition rate: ~5–10 μm/h
• Minimum thickness: ≥500 nm
• Maximum thickness: ≤50 μm

Technical Specifications

Parylene N: Low dissipation factor, suitable for high-frequency RF applications (dielectric loss ~0.0006 at 1 MHz)

Parylene C: Contains a chlorine atom on the benzene ring, resulting in extremely low permeability to moisture and corrosive gases (resistivity: 6–8 × 10¹⁶ Ω·cm at 25°C, 50% RH)

Parylene F: Suitable for high-temperature and UV-resistant applications