Function：Capable of depositing high-quality piezoelectric AlN, AlScN thin films and Mo metal, as well as achieving ultra-smooth planarization treatment of thin films.

Function：Capable of depositing high-quality thin films with precisely controllable thickness, including elemental metals, oxide semiconductors and compound materials, at both room temperature and elevated temperature.

Function：Used for the sputtering deposition of various metal thin films;Reactive sputtering deposition of multiple oxide and nitride thin films; Equipped with the function of in-situ substrate cleaning.

Function：1.Sputtering deposition of various metal thin films; 2.Sputtering of magnetic materials requires prior confirmation from the platform management team.

Function：Sputtering deposition of high-quality optical and dielectric thin films

Function：Deposit various metallic thin films;Deposition of magnetic materials requires prior consultation and confirmation with the platform.