Resistive Thermal Evaporation Coating System

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Resistance Heating Evaporation

Operating

Model：	T550D
Function：	It enables the deposition of high-quality gold films, silver films, and low-melting-point compound films such as MgF2, WO3 and ZnS at room temperature.
Engineer：	Mr. Fu / +86-21- 34206126-6010 / xuecheng.f@1
Location：	Thin Film Zone IV, East Area
Equipment ID：	EFM3RHE01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

Adopting electric heating to melt the materials to be evaporated, the system enables the deposition of high-quality gold films, silver films, and low-melting-point compound films such as MgF2、WO3、ZnS, and on substrates at room temperature.

Process/Testing Capability

The equipment supports the processing of samples with a size below 8 inches.
The thickness of evaporated thin films shall not exceed 500 nm.
The non-uniformity of deposited samples is within ±5% for 8-inch samples (excluding aluminum).

Technical Specifications

The non-uniformity of deposited aluminum samples is within ±7% for 8-inch substrates.
The non-uniformity of deposited gold and silver films is within ±3% for 8-inch substrates.

With resistive heating, high melting point metals (such as tungsten, molybdenum, tantalum, etc.) are fabricated into evaporation sources. The Joule heat generated by high current passing through the evaporation source is used to directly heat and evaporate the coating materials, or to realize indirect heating and evaporation in crucibles, so that the materials can deposit and form thin films on the substrate surface.

The 100 nm gold film deposited by the resistive heating evaporation equipment eliminates discharge spattering and delivers superior film quality.

1.The thickness of deposited thin films shall not exceed 500 nm.

2.A maximum of two types of thin films can be deposited in a single batch.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

这台设备和电子束加热蒸发设备对比缺点是什么

1.钨舟容积小，沉积薄膜厚度受限。

2.有效功率不如电子束蒸发，蒸镀高熔点材料更困难。
02

这台设备和电子束加热蒸发设备对比优点是什么

电子加热不会有电子的积累引起物料飞溅，影响镀膜质量
03

这台设备和电子束加热蒸发的区别是什么

电子束加热的材料需要有导电性，如果是绝缘材料，电荷无法导走，不能继续工作

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