Function：1.The equipment is equipped with a stainless steel ultrasonic tank (300×300 mm), which enables water bath heating and ultrasonic functions for samples. 2.There are no special restrictions on substrates and their surface materials. 3.The equipment can be externally connected to small desktop devices such as heating and ultrasonic units to realize flexible processing. 4.It is suitable for processing small and broken samples.

Function：1.This equipment is equipped with tanks for SPM, SC1, SC2, HF and QDR processes, including one set of large tank (suitable for 4-inch silicon wafer processing) and one set of small tank (suitable for 3-inch silicon wafer processing). 2.It can be used for standard RCA cleaning processes, and individual tanks can also be used independently for cleaning processes in micro-nano fabrication.

Function：Non-destructive drying of samples with complex and fine structures

Function：Capable of automated spin drying for one cassette of 4-inch or 6-inch wafers (up to 25 wafers per batch)Wafers are first rinsed with deionized (DI) water, followed by high-speed spin drying using high-purity nitrogen (N₂)

Function：1.Nitrogen-protected oven 2.Process temperature range: 0–300 °C, adjustable The system is programmable, enabling control of temperature ramp rates, dwell time, and other process parameters, with fully automated recipe execution.