automatic critical point dryer

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Operating

Model：	Automegasamdri-915B
Function：	Non-destructive drying of samples with complex and fine structures
Engineer：	Mr. Tian / +86-21- 34206126-6031 / miaotian@1
Location：	Compound Semiconductor Area, East Zone
Equipment ID：	WW1TCPD01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Primary Application

Dehydration of biological materials prior to electron microscope observation
Drying of MEMS structures with high aspect ratio
Drying of porous materials (e.g., sol-gel materials)
Drying of other samples with fine structures

Process / Testing Capabilities

Wafer size: 6-inch and smaller (including irregular samples)
Materials: SOI, Si, glass, copper sheets and other semiconductor materials (Consult the relevant process engineer for details)

Technical Specifications

Temperature: -30 °C to 60 °C;
The system rapidly cools from room temperature to 0 °C during the drying process;
Pressure: 0-2000 psiPower: 2500 W - 3000 W.

In the supercritical state, there is no longer an interface between gas and liquid; instead, they form a homogeneous fluid with properties intermediate to gas and liquid. This fluid is gradually expelled from the gaps of the sample. Since there is no gas-liquid interface, capillary force is absent, thus avoiding shrinkage of sample gaps and structural damage. The fluid is completely removed from the sample in this way, ultimately yielding a perfectly shape-preserved sample structure.

Supercritical CO₂ drying was adopted to remove the solvent shelf, with the polymer film remaining in its original vertical orientation, which improved its optoelectronic performance.

Sample size: < 6 inchesPlease replace and immerse the samples in IPA (isopropanol) in advance for at least 1 hour (preferably longer).

Please make a reservation in advance. Confirm the sufficient supply of liquid carbon dioxide before starting the process.

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FAQs

01

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