Function：The GNP-Poli 500 is a chemical mechanical polishing (CMP) system for wafer processing. It is primarily used in semiconductor integrated circuit applications, where chemical etching and mechanical abrasion are combined to achieve sub-nanometer surface planarization, wafer thinning, and defect removal.

Function：This system is used for post-cleaning spin drying and baking of 4-inch, 6-inch, and 8-inch standard silicon wafers. It can also be used for independent megasonic cleaning and spin-drying processes.

Function：This system is equipped with two sets of tanks of different sizes, designed for metal wet etching and cleaning processes for 6–8 inch and 3–4 inch wafers. Each tank can process up to 5 wafers simultaneously. The system utilizes SC2 and DHF solutions to perform various steps of metal wet etching and cleaning.

Function：Used for metal wet etching processes for wafers up to 8 inches. Each tank can process up to 5 wafers simultaneously. Supports wet etching and cleaning of different metal thin films using aluminum etching, chromium etching, and SC1 solutions.

Function：This system enables flexible cleaning processes for small samples using various inorganic chemical reagents. Users can operate flexibly with containers such as beakers and petri dishes.

Function：This system is equipped with two sets of tanks of different sizes, suitable for silicon wet etching processes for 6–8 inch and 3–4 inch wafers. Each tank can process up to 5 wafers simultaneously. The system utilizes KOH and KI solutions for silicon wet etching and metal cleaning processes.