Non-CMOS Metal Etch Cleaning Station

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Operating

Model：	Custom
Function：	Used for metal wet etching processes for wafers up to 8 inches. Each tank can process up to 5 wafers simultaneously. Supports wet etching and cleaning of different metal thin films using aluminum etching, chromium etching, and SC1 solutions.
Engineer：	Mr. Li / +86-21- 34206126-6015 / lijinxi@1
Location：	East Area, Inorganic Wet Process IVA Zone
Equipment ID：	EIM4NME01

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Basic Equipment Information
Operating Principle

Main Application

This system is designed for metal and dielectric wet etching and cleaning processes for wafers sized 6–8 inches and 3–4 inches. It is equipped with two sets of tanks of different sizes, each capable of processing up to 5 wafers per batch. Chemical solutions such as phosphoric acid, SPM, and DHF are used for dielectric etching and cleaning processes.

Process / Testing Capabilities

Processes up to 5 wafers (≤8 inches) per batch. Supports wet etching of different metal films using aluminum etchant, chromium etchant, and SC1 solution. Enables multi-step wet chemical processing for metal thin films

Technical Specifications

Dimensions: approximately 1800 (L) × 1200 (W) × 2000 (H) mm
Working surface: 1600 × 900 mm; constructed with 12 mm PP (polypropylene) white panel
Tank size: 225 (L) × 100 (W) × 250 (H) mm

The system performs various cleaning and etching processes through heated chemical baths combined with ultrasonic assistance, enabling effective removal and patterning of metal and dielectric films.

Dedicated equipment for metal and dielectric wet etching processes.

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FAQs

01

此设备可以用户独立操作吗？

需要工艺工程师进行操作

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