Non-CMOS Silicon Etch Cleaning Station

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Operating

Model：	Custom
Function：	This system is equipped with two sets of tanks of different sizes, suitable for silicon wet etching processes for 6–8 inch and 3–4 inch wafers. Each tank can process up to 5 wafers simultaneously. The system utilizes KOH and KI solutions for silicon wet etching and metal cleaning processes.
Engineer：	Mr. Li / +86-21- 34206126-6015 / lijinxi@1
Location：	East Area, Inorganic Wet Process IVA Zone
Equipment ID：	EIM4NSE01

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Basic Equipment Information
Operating Principle

Main Application

This system is designed for silicon wet etching processes for wafers sized 6–8 inches and 3–4 inches. It is equipped with two different tank sizes, each capable of processing up to 5 wafers per batch. Silicon is etched using KOH solution to achieve anisotropic etching, enabling the formation of inverted pyramid structures.

Process / Testing Capabilities

Processes up to 5 wafers (≤8 inches) per batch. Temperature adjustable from 20°C to 100°C. Etch rate and depth can be controlled via temperature and chemical concentration

Technical Specifications

Temperature control accuracy: ±5°C

Heating rate: 2°C/min

Process time can be freely programmed via PLC; system provides an alarm upon completion

Dedicated equipment for silicon etching processes

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FAQs

01

硅刻蚀操作台可以独立操作吗？

需要工艺工程师操作槽体

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