| Model： | Custom |
|---|---|
| Function： | This system is equipped with two sets of tanks of different sizes, designed for metal wet etching and cleaning processes for 6–8 inch and 3–4 inch wafers. Each tank can process up to 5 wafers simultaneously. The system utilizes SC2 and DHF solutions to perform various steps of metal wet etching and cleaning. |
| Engineer： | Mr. Li / +86-21- 34206126-6015 / lijinxi@1 |
| Location： | East Area, Inorganic Wet Process IVA Zone |
| Equipment ID： | EIM4NMR01 |
This system is designed for metal wet etching and cleaning processes for wafers sized 6–8 inches and 3–4 inches. It is equipped with two different tank sizes, each capable of processing up to 5 wafers per batch. SC2 and DHF solutions are used to complete various cleaning and etching steps.
Process / Testing Capabilities
Processes up to 5 wafers (≤8 inches) per batch.SC2 tank includes heating functionality with adjustable temperature settings. Suitable for removing metal layers from sample surfaces
Technical Specifications
Temperature control accuracy: ±5°C. Heating rate: 2°C/min. Wafer compatibility: 6–8 inch wafers use 8-inch tanks, 3–4 inch wafers use 4-inch tanks
需要工艺人员操作
Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China
Tel: +86 21 3420 7734
Email: aemd@sjtu.edu.cn
