Single-Wafer Cleaner

Home > Facilities > Micro-/Nano Fabrication > Wet Cleaning & Etching (incl. CMP) > Single Wafer Cleaner

Equipment Information Guidelines for Contract Processing Inquiry

Single Wafer Cleaner

Operating

Model：	SWC-4000
Function：	This system is used for post-cleaning spin drying and baking of 4-inch, 6-inch, and 8-inch standard silicon wafers. It can also be used for independent megasonic cleaning and spin-drying processes.
Engineer：	Teacher Li / +86-21-34206126-6015 / lijinxi@1
Location：	East Area,IVB Inorganic Wet Processing Zone
Equipment ID：	EIM4WCR01

Reservation

Basic Equipment Information
Operating Principle

Main Application

This system is an auxiliary wet cleaning tool, used for post-cleaning spin drying and baking of 4-inch, 6-inch, and 8-inch standard silicon wafers. It can also be used for independent megasonic cleaning and spin-drying processes.

Process/Testing Capability

The sample surface is rinsed with deionized (DI) water and dried using nitrogen (N₂) blow-drying. The megasonic cleaning function enhances particle removal efficiency.

Technical Specifications

Substrate size: 4-inch, 6-inch, and 8-inch standard full wafers.

The system supports standalone megasonic cleaning, chemical cleaning, PVA brush cleaning, and spin-drying processes.

Samples must be full wafers in 4-inch, 6-inch, or 8-inch formats. Fragmented wafers are not accepted for processing.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

Message Inquiry

If your question is not listed above, please email us at aemd@sjtu.edu.cn or click the button below to submit an inquiry.

Email Inquiry

Note: "@1" represents "@sjtu.edu.cn"