| Model: | Mini RCA |
|---|---|
| Function: | 1.This equipment is equipped with tanks for SPM, SC1, SC2, HF and QDR processes, including one set of large tank (suitable for 4-inch silicon wafer processing) and one set of small tank (suitable for 3-inch silicon wafer processing). 2.It can be used for standard RCA cleaning processes, and individual tanks can also be used independently for cleaning processes in micro-nano fabrication. |
| Engineer: | Mr. Li / +86-21- 34206126-6015 / lijinxi@1 |
| Location: | West Area, Inorganic Wet Process Zone I (Strict Metal Control) |
| Equipment ID: | WW1KRCA01 |
This equipment can be used for standard RCA cleaning processes, and individual tanks can also be operated independently for cleaning processes in micro-nano fabrication. It is an essential cleaning device for micro-nano fabrication.
Process / Testing Capabilities
This equipment is applicable for standard RCA cleaning processes. The SPM tank can be used for cleaning to remove photoresist and organic contaminants from samples; the SC1 tank for the removal of particulate contaminants; the SC2 tank process for eliminating metal ion contaminants; and the HF tank for stripping the silicon oxide thin film on samples.
Technical Specifications
It is suitable for full-wafer processing of 4-inch and 3-inch wafers, with a capacity of 6 to 7 wafers per tank. The SPM tank, SC1 tank and SC2 tank are all equipped with heating functions, enabling temperature control from room temperature up to 140 °C. In addition, the SC1 tank is fitted with an ultrasonic function for more effective removal of particulate contaminants on the sample surface.


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