Function：1.Deep silicon etching using Bosch or non-Bosch processes. 2.TSV (Through-Silicon Via) deep silicon etching. 3.Surface silicon structure etching for SOI wafers.

Function：1. Deep silicon etching using Bosch or non-Bosch processes 2. TSV (Through-Silicon Via) deep silicon etching 3. Surface silicon structure etching for SOI wafers

Function：1.Deep silicon etching using Bosch or non-Bosch processes 2.TSV (Through-Silicon Via) deep silicon etching 3.Surface silicon structure etching for SOI wafers

Function：1.Etching of dielectric thin films such as silicon dioxide (SiO₂), silicon nitride (Si₃N₄), and silicon oxynitride (SiON). 2.Etching of silicon carbide (SiC) thin films. 3.Quartz etching.

Function：1.Etching of dielectric thin films such as silicon dioxide (SiO₂), silicon nitride (Si₃N₄), and silicon oxynitride (SiON) 2.Etching of silicon carbide (SiC) thin films 3.Quartz etching

Function：Dry etching system primarily used for high-aspect-ratio etching of quartz and lithium niobate (LiNbO₃) materials.