Function：XeF₂ (Xenon Difluoride) silicon etching is a dry etching technology based on gas-phase chemical reactions. It features mild etching conditions and excellent selectivity, with a high etching selectivity ratio against metals, silicon dioxide, and silicon nitride.

Function：1.Photoresist ashing (stripping) after dry etching;2.Plasma modification on substrate surface;3. Substrate cleaning before photoresist coating to remove organic contaminants.

Function：1. Dry removal of positive and negative (SU8) photoresists;2. Dry removal of polyimide (PI);3. Dry removal of organic contaminants;4. Substrate surface plasma modification (O₂/Ar);5. Surface cleaning, activation, etching and modification.

Function：1. Plasma cleaning of substrate surface 2. Surface modification treatment of substrate (O₂ or N₂)