HP-303DU热板
(HP-303DU hotplate)
主要技术指标/Specifications:
- 温度范围：室温~380℃
Temperature range: room temperature~380℃
- 温度精度：≤±1%
Temperature accuracy: ≤±1%
主要用途/Applications:
半导体光刻工艺中最大尺寸达300×300 基片光刻胶烘烤。
Resist baking to drive off solvents and to solidify the film.
