DWL66+ 激光直写光刻机

（DWL66+ Direct-Write Laser System）

主要用途/ Application：

1. 掩模板制作功能：制作紫外光刻掩膜版；
2. 光刻胶直写功能：在基片上直写亚微米到微米尺度的光刻胶图形；
3. 套刻直写功能：多次曝光工艺之间的套刻直写，套刻精度500nm；
4. 三维灰阶光刻功能：利用软件来控制激光的能阶，在光刻胶上实现三维光刻胶结构。

 

1. Mask plate making function: make UV lithography mask plate;
2. Photoresist direct writing function: direct writing of submicron to micron scale photoresist graphics;
3. Sleeve lithography function: sleeve lithography between multiple exposure processes, sleeve lithography accuracy of 500nm;
4. Three-dimensional grayscale lithography function: use software to control the laser energy level to realize three-dimensional photoresist structure on the photoresist.

 

设备工作原理简介/ Operating principle：

激光直写光刻作为一种无掩模光刻技术，是利用强度可变的激光束对基片表面的抗蚀材料实施变剂量曝光，显影后在抗蚀层表面形成所要求的图形。能够实现高精度加工，不需要制作模板，可以适用于多种不同材料的加工，包括玻璃、金属、硅片、半导体、聚合物等

Laser direct writing lithography, as a maskless photolithography technology, utilizes a laser beam of variable intensity to implement variable-dose exposure of the resist material on the surface of the substrate, and after development, the required pattern is formed on the surface of the resist layer. It is capable of high-precision processing without the need for templates, and can be applied to a wide range of different materials, including glass, metal, silicon wafers, semiconductors, polymers, etc.

 

技术指标/ Specifications：

可选激光分辨率：0.6,1.0 μm

灰度直写阶数: 255级

Optional laser resolution: 0.6,1.0 μm

Number of grayscale levels : 255 levels

 

典型使用案例/ Typical scenario：

光刻胶图形直写，灰度曝光，掩膜版加工

Mask production, Photo resist direct writing, Grayscale writing.

 

设备类别/Facilities：光刻/图形化设备/ Lithography/Patterning Equipment

设备编号/No.：ELT3DWL01

设备地点/Location：东区光刻ⅢA区/ Lithography Area III-A

 

工艺工程师/Engineer in response:

姓名：王凤丹；邮箱：fdwang@sjtu.edu.cn；电话：021-34206126-6005

Name: Fengdan Wang；Email：fdwang@sjtu.edu.cn; Tel: 021-34206126-6005.

 

设备照片/Photos：