激光植球机

（Laser Solder Jetting System）

主要用途/ Application：

激光植球机用于在单芯片、各类基板、晶圆、BGA等半导体或微电子器件的焊盘上进行选择性激光植球或者阵列微凸点加工，特别适用于单芯片倒装凸点的制作和窄节距焊球的植球。设备适用于40μm-450μm的焊球直径，适用于各种常见合金的焊球，如 SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi 等。

The Laser Solder Jetting system is used for selective laser ball implantation or micro-bump array processing on the pads of semiconductor or microelectronic devices such as single chips, PCB & flex substrates, wafers, and BGAs. It is especially suitable for the production of flip chip bumps and the implantation of narrow pitch balls. Available solder ball diameters range from 40 μm to 450 μm. The equipment can be applied to solder balls of various common alloys, such as SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi, etc.

设备工作原理简介/ Operating principle：

激光植球就是采用激光熔化焊球并喷射到对应焊盘上来形成凸点的方法。单颗焊球首先通过存储系统输送到喷嘴，在激光的作用下加热熔化并在氮气流的作用下喷射至焊盘表面。

A single solder ball is isolated from a reservoir and conveyed across a singulation disk to the capillary tip. It is then immediately melted by the laser. The molten droplet is subsequently expelled from the capillary by a pulse of pressurized nitrogen (N2). Finally, the molten solder is jetted onto the target location, where it adheres to the contact surfaces, solidifies, and forms a stable, reliable bond.

工艺能力/ Capability：

1、工作台尺寸：320×320mm

2、焊球直径范围：40 μm-450 μm

3、最大植球速度：最大5球/秒

1、Workspace：320×320mm

2、Solder ball diameters：40 μm-450 μm

3、Solder Ball Speed：5 balls/s

典型使用案例/ Typical scenario：

激光植球机SB²-Jet适用于在各种半导体或微电子器件上进行选择性植球或阵列微凸点加工。

1、倒装芯片凸点