PVA-TePla微波等离子去胶机/表面处理机
(PVA-Tepla Microwave Stripper /Plasma processing system)
主要技术指标/Specifications:
- 腔体尺寸:直径248mm*245mm深
Chamber size: diameter248mm*deep245mm
- 电源频率及功率:2.45GHz,600W
RF Generator:2.45GHz,600W
- 基片尺寸:8寸并向下兼容6、5、4、3、2英寸等以及破片
substrate size: Up to 8inch, applicable to 6, 5, 4, 3, 2 inch and broken pieces
- 气体配备:O2、N2极限真空:<1´10–7Torr
Gas: O2, N2; Base pressure: <1´10–7Torr
主要用途/Applications:
光刻胶去除及表面改性与清洁
Photoresist stripping, surface modification and cleaning with plasma.