MOT电镀镍

（MOT Electroplating system Ni）

主要用途/ Application：

此设备主要用于镍电镀。电镀镍有良好的导电性稳定性和延展性。被广泛应用于半导体互连工艺；也可以作为导电材料应用于和芯片保护中的防腐蚀镀层。镍孔隙率高，是广泛使用的一种预镀层，可用于改善镀层结合力。

This equipment is primarily used for electroplating Ni. Electroplated nickel has good conductivity, stability, and ductility. Widely used in semiconductor interconnect processes; It can also be used as a conductive material for anti-corrosion coatings in chip protection. Nickel has a high porosity and is a widely used pre coating, which can be used to improve the adhesion of the coating.

 

设备工作原理简介/ Operating principle：

镍电镀是一种利用电化学方法在基体表面沉积镍层的工艺。其电镀液有镍盐、导电盐、pH调节剂等组成。电镀过程中将基体作为阴极，通电后，镍离子在阴极表面还原析出，形成镍镀层。

Nickel electroplating is a process that uses electrochemical methods to deposit a layer of nickel on the surface of a substrate. The electroplating solution consists of nickel salt, conductive salts, pH adjusters, and other components. During the electroplating process, the substrate is used as the cathode. After the current is applied, nickel ions are reduced and deposited on the surface of the cathode to form a nickel film.

 

工艺能力/ Capability：

10微米以上线宽；

0.5-20微米厚度；

Line width greater than 10 micrometers;

Thickness of 0.5-20 micrometers;

 

技术指标/ Specifications：

3、4、6寸标准尺寸晶圆。

晶圆厚度：350um-1000um

150mm尺寸以下异形样品（含破片）

3. 4. 6-inch size wafer.

Wafer thickness: 350um-1000um

Irregular samples (including fragments) with a size below 150mm

 

典型使用案例/ Typical scenario：

电镀镍工艺：

光刻胶厚度 5um，形成图形

电镀0.5-1.5um镍。

Electroplated nickel plating process:

1) The photoresist thickness is 5um, forming a pattern.

2) Electroplating 0.5-1.5um nickel.

 

设备类别/Facilities：电镀/电铸系统设备/ Electroplating/Electrocasting System

设备编号/No.：EPL0NIK01

设备地点/Location：东区电镀区/ East Plating Area

 

工艺工程师/Engineer in response:

姓名：田苗；邮箱：miaotian@sjtu.edu.cn 电话：021-34206126-6031

Name: Miao Tian; Email：miaotian@sjtu.edu.cn Tel: 021-34206126-6031.

 

设备照片/Photos：