MOT电镀金
（MOT Electroplating system Au）
主要用途/ Application：
此设备主要用于金电镀，采用环保无氰电镀液。电镀金层具有出色的导电性、耐腐蚀性、可焊性以及热压键合性能，是集成电路I/O接点和芯片互连的理想选择。电镀金可用于集成电路芯片封装的各个环节，如引线框架镀金、芯片管脚镀金、焊球连接等。
This equipment is primarily used for gold plating, employing a cyanide-free plating solution. The electroplated gold demonstrates exceptional electrical conductivity, corrosion resistance, solderability, and thermocompression bonding properties, making it well-suited for integrated circuit I/O connections and chip interconnections. Applications span the entire integrated circuit chip packaging process, including lead frame plating, chip pin plating, and solder ball bonding.
设备工作原理简介/ Operating principle：
金电镀是一种利用电化学方法在基体表面沉积金层的工艺。其电镀液有金盐、导电盐、pH调节剂等组成。电镀过程中将基体作为阴极，通电后，金离子在阴极表面还原析出，形成金镀层。
Gold electroplating is a process that uses electrochemical methods to deposit a layer of gold on the surface of a substrate. The electroplating solution consists of gold salts, conductive salts, pH adjusters, and other components. During the plating process, the substrate is used as the cathode. After the current is applied, gold ions are reduced and deposited on the surface of the cathode to form a gold coating.
工艺能力/ Capability：
10微米以上线宽；
0.5-10微米厚度；
Line width greater than 10 micrometers;
Thickness of 0.5-10 micrometers;
技术指标/ Specifications：
3、4、6寸标准尺寸晶圆。
晶圆厚度：350um-1000um
接受破片，尺寸小于150mm
- 4. 6-inch size wafer.
Wafer thickness: 350um-1000um
Accepting fragments: smaller than 150mm
典型使用案例/ Typical scenario：
微凸点工艺：
1）在基片上溅射Au金属作为电镀的种子层；
2）涂布光刻胶，光刻显影出电镀所需的图形；
3） 清洗后进行电镀金，通过植球-回流形成凸点。Nano imprint anti – stick layers
Micro-bump process:
1) Sputtering Au metal on the substrate as a seed layer for electroplating;
2) Apply photoresist and develop the required pattern for electroplating through photolithography;
3) After cleaning, electroplating gold is carried out, and bump are formed through solder and reflow.
设备类别/Facilities：电镀/电铸系统设备/ Electroplating/Electrocasting System
设备编号/No.：EPL0GOL01
设备地点/Location：东区电镀区/ East Plating Area
工艺工程师/Engineer in response:
姓名：田苗；邮箱：miaotian@sjtu.edu.cn 电话：021-34206126-6031
Name: Miao Tian; Email：miaotian@sjtu.edu.cn Tel: 021-34206126-6031.
设备照片/Photos：
