烧杯电镀锡
(Electroplating Sn in beaker)
主要用途/ Application:
此设备主要用于锡电镀。电镀锡有良好的导电性、可焊性、抗腐蚀性和延展性,因此被广泛应用于半导体行业。例如,电镀锡可以用于芯片封装中的引线键合和焊球连接,也可以作为导电材料应用于互连工艺,也可以用于芯片保护中的防腐蚀镀层。
This equipment is primarily used for electroplating Sn. Electroplated tin offers excellent conductivity, solderability, corrosion resistance, and ductility, making it widely used in the semiconductor industry. For example, electrodeposited Sn can be used as a solder material for wire bonding and solder ball bonding in chip packaging, as a conductive material in interconnect technology, and as an anti-corrosion plating for chip protection.
设备工作原理简介/ Operating principle:
锡电镀是一种利用电化学方法在基体表面沉积锡层的工艺。其电镀液有锡盐、导电盐、pH调节剂等组成。电镀过程中将基体作为阴极,通电后,锡离子在阴极表面还原析出,形成锡镀层。
Tin electroplating is a process that uses electrochemical methods to deposit a layer of tin on the surface of a substrate. The electroplating solution consists of tin salts, conductive salts, pH adjusters, and other components. During the electroplating process, the substrate is used as the cathode. After the current is applied, tin ions are reduced and deposited on the surface of the cathode to form a tin coating.
工艺能力/ Capability:
- 20微米以上线宽;
- 1-20微米厚度;
- Line width greater than 20 micrometers;
- Thickness of 1-20 micrometers;
技术指标/ Specifications:
4寸以下基底。
Substrate less than 4 inches.
典型使用案例/ Typical scenario:
微凸点工艺:
- 光刻胶厚度 20um,形成孔径40um
- 电镀10-15um铜,再电镀5-10um锡
Micro-bump process:
- Photoresist thickness 20um, forming vias with diameter of 40um.
- Electroplate 10-15um Cu, then electroplate 5-10um Sn.
设备类别/Facilities:电镀/电铸系统设备/ Electroplating/Electrocasting System
设备编号/No.:WW2ESNS01
设备地点/Location:西区湿法II区
工艺工程师/Engineer in response:
姓名:田苗;邮箱:miaotian@sjtu.edu.cn
Name: Miao Tian; Email:miaotian@sjtu.edu.cn
设备照片/Photos: