HP-200半自动热板

（Hotplate HP-200）

主要用途/ Application：

HP-200 是一款高精度热板设备，专为实验室和小规模生产设计，用于各种涂覆和光刻工艺中的热处理环节。其主要用途包括：

1. 光刻胶预烘和后烘： 在涂覆光刻胶后的软烘和曝光后的硬烘，以增强图案稳定性和光刻性能。
2. 退火处理： 用于半导体器件和薄膜的热处理以优化材料特性。

3. 加热均匀性需求： 针对敏感基材的精确温度控制和均匀加热，适用于微电子、MEMS 和光电子器件。

The HP-200 is a high-precision hot plate designed for laboratory and small-scale production environments. It is widely used in thermal processes for coating and photolithography. Key applications include:

1. Photoresist Prebake and Postbake: Soft bake after photoresist coating and hard bake after exposure to enhance pattern stability and lithographic performance.
2. Annealing Processes: Thermal treatment for semiconductor devices and thin films to optimize material properties.

3. Uniform Heating Requirements: Precise temperature control and uniform heating for sensitive substrates, applicable to microelectronics, MEMS, and optoelectronic devices.

 

设备工作原理简介/ Operating principle：

HP-200 的工作原理基于高效热传递和精密温控技术：

1. 均匀加热平台： 设备配备高导热性材料的加热板，确保在整个基材表面实现均匀的热量分布。
2. 精准温控： 温度控制范围广泛且精确，通常在室温到300℃之间可调，温度稳定性达到±1℃。
3. 真空吸附功能（可选）： 基材可通过真空吸附固定在加热板上，确保接触良好并避免热量损失。
4. 自动程序设置： 操作界面支持自定义温度、加热时间和升温/降温速率，以满足不同工艺需求。
5. 高可靠性： 配备保护功能，防止过热和功率波动对工艺的影响。

HP-200 提供高效、可靠和灵活的热处理能力，适用于光刻工艺、材料研究和器件开发。

The  HP-200 operates on efficient heat transfer and precise temperature control technologies:

1. Uniform Heating Plate: The device features a high thermal conductivity heating plate that ensures uniform heat distribution across the entire substrate surface.
2. Precise Temperature Control: Temperature ranges from room temperature to 300°C with a stability of ±1°C, meeting a wide range of processing needs.
3. Vacuum Chuck Function (Optional): Substrates can be securely fixed onto the heating plate via vacuum suction, ensuring good contact and preventing heat loss.
4. Automated Program Settings: The user interface supports customized settings for temperature, heating duration, and ramp-up/down rates to meet specific process requirements.
5. High Reliability: Equipped with protective functions to prevent overheating and mitigate power fluctuations during operation.

The HP-200 offers efficient, reliable, and flexible thermal processing capabilities, ideal for photolithography, material research, and device development.

 

工艺能力/ Capability：

1、温度范围0°C至250°C
2、温度精度：+/- 0.6°C（100℃）
3、工作模式：接近式，接近距离：0-8mm；通过顶针可调节热板与晶圆间距
4、热板加工尺寸：最大8英寸，向下兼容

 

Temperature control with digital target and actual value display

User-friendly process configuration with touch screen panel

Quick start/stop function for repeat processes

Automatic temperature limit switch, no overheating

Heating ramp up possible with 24 program-steps

Proximity as well as loading pins, can be easily adapted to different substrate sizes Hotplate with safety glass, easy cleaning

Easy levelling of the hotplate, prevents discharge of photoresist

Manual substrate fixation via vacuum

Manual loading and unloading of the substrates

 

技术指标/ Specifications:

1、温度范围0°C至250°C
2、温度精度：+/- 0.6°C（100℃）
3、工作模式：接近式，接近距离：0-8mm；通过顶针可调节热板与晶圆间距
4、热板加工尺寸：最大8英寸，向下兼容

 

Temperature range: ambient temperature up to 250°C

Temperature accuracy: +/- 0.6°C at 100°C

Electrical driven proximity and loading pins (stroke 8 mm)

Program controlled adjustable proximity pins (0.1 mm increments)

Pin-circle-diameters Ø 45mm (2″) / Ø 92mm (4″) / Ø 142mm (6″) / Ø 192mm (8″)

 

典型使用案例/ Typical scenario：

设备类别/Facilities：光刻辅助设备/ Lithography Misc

设备编号/No.：EDD2HPS01、EDD2HPS02

设备地点/Location：东区显影Ⅱ区/ East Developing Area II

 

工艺工程师/Engineer in response:

姓名：张笛；邮箱：captianzhangdi@sjtu.edu.cn；电话：13651735947

Name: Di Zhang；Email：captianzhangdi@sjtu.edu.cn; Tel: 13651735947.

设备照片/Photos：