SMD-200半自动显影机

（Developer SMD-200）

主要用途/ Application：

SMD-200 是一款高性能的均匀涂布设备，专门设计用于实验室和小批量生产环境中的薄膜涂覆工艺。该设备广泛应用于以下领域：

1. 光刻工艺： 用于在半导体晶圆、玻璃或其他基材上均匀涂覆光刻胶。
2. 保护涂层： 为电子元件提供抗腐蚀或抗氧化的保护涂层。
3. 功能涂层： 应用于微电子、光学元件和生物医学领域的功能性薄膜沉积。

The SMD-200 is a high-performance uniform coating device designed for laboratory and small-scale production environments. It is widely used in the following fields:

1. Photolithography Process: For uniformly applying photoresists on semiconductor wafers, glass, or other substrates.
2. Protective Coatings: To provide anti-corrosion or anti-oxidation protective layers for electronic components.
3. Functional Coatings: For depositing functional films in microelectronics, optical components, and biomedical applications.

设备工作原理简介/ Operating principle：

SMD-200 的工作原理基于旋转涂覆和精准分布：

1. 液体分配： 将光刻胶或涂覆液手动或通过自动分配装置均匀滴在基材的中心区域。
2. 旋转涂覆： 基材通过真空吸附固定在旋转台上，以设定的旋转速度进行涂覆。离心力将涂覆液均匀分布在基材表面。
3. 厚度控制： 涂层厚度由旋转速度、加速度、持续时间和涂覆液体的黏度决定，设备提供了多段速度程序以满足复杂工艺需求。
4. 干燥和后处理： 涂覆完成后可转移至烘干设备进行固化或后续处理。

SMD-200 配备触摸屏界面，操作便捷，同时支持不同尺寸基材的高精度涂覆需求。

 

The SMD-200 operates based on spin-coating and precise distribution:

1. Liquid Dispensing: Photoresists or coating liquids are manually or automatically dispensed uniformly onto the center area of the substrate.
2. Spin Coating: The substrate is held securely on a rotating platform via vacuum suction and is spun at a preset speed. Centrifugal force distributes the coating liquid evenly across the substrate surface.
3. Thickness Control: Coating thickness is determined by rotation speed, acceleration, duration, and liquid viscosity. The device offers multi-step speed programs to accommodate complex process requirements.
4. Drying and Post-Processing: After coating, the substrate can be transferred to drying units for curing or further treatment.

Equipped with a touch-screen interface, the SMD-200 is user-friendly and supports high-precision coating requirements for substrates of varying sizes.

 

工艺能力/ Capability：

1、可支持2/3/4/5/6/7/8英寸等不同尺寸的晶圆旋涂
2、最多支持 20 个步骤
3、显影台转速范围：0~3000rpm，加速度在0.3秒达到6000rpm
4、支持显影机械臂来回移动、浸润、流水、喷雾等多种显影方式
5、支持氮气、旋涂、背洗干燥

 

Up to 50 programmes with 24 segments each can be programmed

Quick start function for repeat processes

User-friendly process configuration with touch screen panel

Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time

Electrical driven spray arm, with dynamic or static function

Developer line and media tank (2 litre) for one developer included

Nozzle for DI-water-rinse and N2 drying on the spray arm Nozzles in the process bowl for the backside rinse

Control elements for dosing of the compressed air and vacuum

Rotational direction can be selected (CW, CCW)

Manual loading and unloading of the substrates

Mechanical substrate fixation

Acoustic signal when the process has finished

 

技术指标/ Specifications:

1、可支持2/3/4/5/6/7/8英寸等不同尺寸的晶圆旋涂
2、最多支持 20 个步骤
3、显影台转速范围：0~3000rpm，加速度在0.3秒达到6000rpm
4、支持显影机械臂来回移动、浸润、流水、喷雾等多种显影方式
5、支持氮气、旋涂、背洗干燥

 

Speed range: 0 to 3’000rpm +/-1rpm 1)

Speed acceleration: 0 to 3’000rpm in 0.3 seconds 1)

Process time up to 2376 seconds

Developer spray time 99 seconds/segment

Speed of the spray arm 10 to 100mm/second

Rinse and N2 drying 99 seconds/segment

Heatable process hood up to 50°C

Spray nozzle made of PEEK 0,8mm

 

典型使用案例/ Typical scenario：

设备类别/Facilities：光刻辅助设备/ Lithography Misc

设备编号/No.：EDD2SMD01

设备地点/Location：东区显影Ⅱ区/ East Developing Area II

 

工艺工程师/Engineer in response:

姓名：张笛；邮箱：captianzhangdi@sjtu.edu.cn；电话：13651735947

Name: Di Zhang；Email：captianzhangdi@sjtu.edu.cn; Tel: 13651735947.

设备照片/Photos：